Posted: 12-10-2024
Title: Advanced Ferroelectric-Based Sensing, Packaging and Integration
Location: Army Research Lab – Adelphi Laboratory Center – Adelphi, MD
Description: The U.S. DEVCOM Army Research Laboratory (ARL) is pleased to announce an exciting opportunity for a summer internship with a focus on microsystems, ferroelectrics, 2.5D integration and MEMS. Responsibilities will include circuit design, chip to chip bonding, and testing. The successful candidate will primarily be stationed in Adelphi, Maryland. Key Responsibilities include: conducting innovative research in the design, fabrication, and testing of microsystems, sensors, and MEMS technologies, and present research findings to ARL scientists.
Requirements:
- Effective communication skills, both written and verbal.
- Ability to work in a team and collaborate with researchers from diverse backgrounds.
- Experience with basic circuitry and breadboarding, and SPICE tools.
- Experience with COMSOL
- Experience with ferroelectrics and or MEMS devices.
Level: Multiple Classifications
Required Major(s): Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related field.
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